By Nauman Khan
This booklet explores the demanding situations and offers most sensible thoughts for designing Through-Silicon Vias (TSVs) for 3D built-in circuits. It describes a singular strategy to mitigate TSV-induced noise, the GND Plug, that's more suitable to others tailored from 2-D planar applied sciences, resembling a bottom floor aircraft and standard substrate contacts. The booklet additionally investigates, within the type of a comparative examine, the impression of TSV dimension and granularity, spacing of C4 connectors, off-chip energy supply community, shared and committed TSVs, and coaxial TSVs at the caliber of energy supply in 3-D ICs. The authors offer special most sensible layout practices for designing three-D energy supply networks. considering that TSVs occupy silicon real-estate and effect machine density, this publication presents 4 iterative algorithms to reduce the variety of TSVs in an influence supply community. in contrast to different latest tools, those algorithms might be utilized in early layout phases while purely practical block- point behaviors and a ﬂoorplan can be found. ultimately, the authors discover using Carbon Nanotubes for energy grid layout as a futuristic substitute to Copper.
Read Online or Download Designing TSVs for 3D Integrated Circuits PDF
Similar design & architecture books
The decade has obvious great progress in utilization of the area vast internet. net caching is a know-how geared toward lowering the transmission of redundant community site visitors and enhancing entry to the net. the major concept in internet caching is to cache usually- accessed content material in order that it can be used profitably later.
According to a convergence of community applied sciences, the subsequent new release community (NGN) is being deployed to hold top of the range video and voice information. in reality, the convergence of community applied sciences has been pushed by way of the converging wishes of end-users. The perceived end-to-end caliber is among the major pursuits required via clients that needs to be assured by means of the community operators and the web carrier prone, via producer gear.
This is often the 1st textbook on a quite often appropriate keep an eye on technique for turbulence and different advanced nonlinear platforms. The process of the booklet employs strong tools of computing device studying for optimum nonlinear regulate legislation. This computing device studying keep an eye on (MLC) is inspired and distinctive in Chapters 1 and a couple of.
Additional resources for Designing TSVs for 3D Integrated Circuits
6 μm2 vs. 4 μm2 ). This huge area penalty, creates large interconnect blockages and reduces the area available for active devices. 2 Backside Ground Plane During assembly and packaging stages, a 2-D die is placed on a grounded metal layer. As mentioned in Sect. 1, the same idea can be extended to 3-D ICs where the substrate has a backside grounded metal, in preferable plate or grid format, creating a strong GND reference for substrate. To model this technique, we add a Cu sheet in the default setup shown in Fig.
8. N. Khan and S. 1 Problem: Power Delivery for 3-D ICs 3-D integration poses grand power delivery challenges for two reasons: increased power density and package asymmetry. Contrast a 3-D IC with a functionally comparable 2-D IC. The average wire length for a 3-D IC drops by a factor of N1/2 where N is the number of dies in the 3-D IC, and the wire resistance and capacitance decreases proportionally . Assuming that the design is interconnect-dominated, power is expected to drop by a factor of N1/2 .
42], where four SPEC workloads (apsi, bzip, equake, and mcf) were run for 100 million instructions using Wattch , and 2,048 cycle snippets (8,192 total traces) representing the current patterns were then extracted. Such a power grid evaluation methodology replaces observing millions of instructions from a wide variety of benchmarks, thus significantly saving power grid simulation times. 3 Optimal TSV Size for 3-D PDN We examine in this section how TSV size impacts 3-D power delivery. TSV size is the dimension of one side of the square TSV footprint.